Tarifs IFTEC des standards IPC au 03 septembre 2024
Tarifs IFTEC des standards IPC
| TARIF IFTEC STANDARDS IPC Au 22/10/25 Valide jusqu'au 22/11/2025 Coût Transport / Emballage |
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|---|---|---|---|---|
| Colissimo France : | Colissimo Etranger (zone A - Zone B) : | |||
| poids < 500g | 18€ | 32€ | 45€ | poids < 500g |
| poids > 500g < 1kg | 22€ | 37€ | 53€ | poids > 500g < 1kg |
| poids > 1kg < 2kg | 27€ | 43€ | 58€ | poids > 1kg < 2kg |
| poids > 2kg < 5kg | 35€ | 53€ | 73€ | poids > 2kg < 5kg |
| poids > 5kg < 10kg | 55€ | 82€ | 117€ | poids > 5kg < 10kg |
| REFERENCE IPC | POIDS | PRIX | TITRE | ||
|---|---|---|---|---|---|
| 1072 | CD | IPC-1072(E)1 | 54 g | 101€ | Intellectual Property Protection in Electronic Assembly Manufacturing |
| D | IPC-1072(D)1 | - | 111€ | ||
| 1602A | LIV | IPC-1602A | 110 g | 189€ | Standard for Printed Board Handling and Storage |
| D | IPC-1602A(D)1 | - | 173€ | ||
| 1782B | LIV | IPC-1782B | 150 | 194€ | Standard for Manufacturing and Supply Chain Traceability of Electronic Products |
| D | IPC-1782B | - | 177€ | ||
| 1791D | LIV | IPC-1791D | 80 | 174€ | Trusted Electronic Designer, Fabricator and Assembler Requirements |
| D | IPC-1791D(D)1 | - | 167€ | ||
| 2141A | D | IPC-2141A(D)1 | - | 148€ | Design Guide for High-Speed Controlled Impedance Circuit Boards |
| 2152 | D | IPC-2152(D)1 | - | 183€ | Standard for Determining Current Carrying Capacity in Printed Board Design |
| 2221C | LIV | IPC-2221C | 422 | 235€ | Generic Standard on Printed Board Design |
| D | IPC-2221C(D)1 | - | 212€ | ||
| 2222B | LIV | IPC-2222B | 120 | 163€ | Sectional Design Standard for Rigid Organic Printed Boards |
| D | IPC-2222B(D)1 | - | 151€ | ||
| 2222B-FR | LIV | IPC-2222B-FR | 120 | 281€ | Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides (French Language) |
| D | IPC-2222B-FR(D)1 | - | 251€ | ||
| 2223E | LIV | IPC-2223E | 200 | 202€ | Sectional Design Standard for Flexible / Rigid Flexible Printed Boards |
| D | IPC-2223E(D)1 | - | 183€ | ||
| 2225 | CD | IPC-2225(E)1 | 54 | 138€ | Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies |
| D | IPC-2225(D)1 | - | 148€ | ||
| 2226A | D | IPC-2226A(D)1 | - | 183€ | Sectional Design Standard for High Density Interconnect (HDI) Boards |
| 2228 | LIV | IPC-2228 | 400 | 134€ | Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards |
| D | IPC-2228(D)1 | - | 126€ | ||
| 2231A | LIV | IPC-2231A | 160 | 195€ | DFX Guidelines |
| D | IPC-2231A(D)1 | - | 186€ | ||
| 2251 | CD | IPC-2251(E)1 | 54 | 138€ | Design Guide for the Packaging of High Speed Electronic Circuits |
| D | IPC-2251(D)1 | - | 158€ | ||
| 2291 | CD | IPC-2291(E)1 | 54 | 101€ | Design Guideline for Printed Electronics |
| D | IPC-2291(D)1 | - | 111€ | ||
| 2292A | LIV | IPC-2292A | 300 | 202€ | Design Standard for Printed Electronics on Flexible Substrates |
| D | IPC-2292A(D)1 | - | 183€ | ||
| 2581C | LIV | IPC-2581C | 710 | 202€ | Generic Requirements for Printed Board Assembly Products Manufacturing Description Data an Transfer Methodology |
| D | IPC-2581C(D)1 | - | 183€ | ||
| 2591-V2 | LIV | IPC-2591-V2 | 250 | 202€ | Connected Factory Exchange (CFX) |
| D | IPC-2591-V2(D)1 | - | 183€ | ||
| 2591-FR | D | IPC-2591-FR(D)1 | - | 261€ | Echanges au Sein d'une Usine Connectée (CFX) |
| 2611 | D | IPC-2611(D)1 | - | 111€ | Generic Requirements for Electronic Product Documentation |
| 2612 | CD | IPC-2612(E)1 | 54 | 101€ | Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) |
| D | IPC-2612(D)1 | - | 111€ | ||
| 2612-1 | CD | IPC-2612-1(E)1 | 54 | 138€ | Sectional Requirements for Electronic Diagramming Symbol Generation Methodology |
| D | IPC-2612-1(D)1 | - | 148€ | ||
| 2614 | D | IPC-2614(D)1 | - | 148€ | Sectional Requirements for Board Fabrication Documentation |
| 2615 | D | IPC-2615(D)1 | - | 148€ | Printed Board Dimensions and Tolerences |
| 4101E-WAM1 | LIV | IPC-4101E-WAM1 | 490 | 210€ | Specification for Base Materials for Rigid and Multilayer Printed Boards |
| D | IPC-4101E-WAM1(D)1 | - | 183€ | ||
| 4103B | D | IPC-4103B(D)1 | - | 153€ | Specification for High Density Interconnect (HDI) and Microvia Materials |
| 4104 | D | IPC-4104(D)1 | - | 148€ | Specification for High Density Interconnect (HDI) and Microvia Materials |
| 4121 | CD | IPC-4121(E)1 | 54 | 101€ | Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications |
| D | IPC-4121(D)1 | - | 111€ | ||
| 4202C | LIV | IPC-4202C | 100 | 118€ | Specification for Flexible Base Dialectics for use in Flexible Printed Boards |
| D | IPC-4202C(D)1 | - | 111€ | ||
| 4203C | LIV | IPC-4203C | 150 | 165€ | Cover and Bonding Material for Flexible Printed Circuitry |
| D | IPC-4203C(D)1 | - | 153€ | ||
| 4204B | D | IPC-4204B(D)1 | - | 153€ | Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards |
| 4412C | LIV | IPC-4412C | 100 | 118€ | Specification for Finished Fabric Woven from "E" Glass for Printed Boards |
| D | IPC-4412C(D)1 | - | 111€ | ||
| 4552B | LIV | IPC-4552B | 540 | 236€ | Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards |
| D | IPC-4552B(D)1 | - | 213€ | ||
| 4553A | CD | IPC-4553A(E)1 | 54 | 173€ | Specification for Immersion Silver Plating for Printed Boards |
| D | IPC-4553A(D)1 | - | 183€ | ||
| IPC-4554- WAM1 | D | IPC-4554-WAM1(D)1 | - | 183€ | Specification for Immersion Tin Plating for Printed Circuit Boards - With Amendment 1 |
| 4555 | LIV | IPC-4555 | 240 | 134€ | Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards |
| D | IPC-4555(D)1 | - | 126€ | ||
| 4556 | CD | IPC-4556(E)1 | 54 | 173€ | Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards |
| D | IPC-4556(D)1 | - | 183€ | ||
| 4562B | LIV | IPC-4562B | 150 | 174€ | Metal Foil for Printed Board Applications |
| D | IPC-4562B(D)1 | - | 148€ | ||
| 4591A | D | IPC-4591A(D)1 | - | 113€ | Requirements for Printed Electronics Functional Conductive Materials |
| 4781 | D | IPC-4781(D)1 | - | 111€ | Qualification and Performance Specification of Permanent, Semo-Permanent and Temporary Legend and/or Marking Ink |
| 4921A | D | IPC-4921A(D)1 | - | 111€ | Requirements for Printed Electronics Base Materials (Substrates) |
| 5262 | LIV | IPC-5262 | 70 | 165€ | Design, Critical Process and Acceptance Requirements for Polymeric Applications |
| D | IPC-5262(D)1 | - | 153€ | ||
| 5703 | D | IPC-5703(D)1 | - | 111€ | Cleanliness Guidelines for Printed Board Fabricators |
| 5704 | D | IPC-5704(D)1 | - | 111€ | Cleanliness Requirements for Unpopulated Printed Boards |
| 6011A | LIV | IPC-6011A | 60 | 118€ | Generic Performance Specification for Printed Boards |
| D | IPC-6011A(D)1 | - | 111€ | ||
| 6012F | LIV | IPC-6012F | 140 | 210€ | Qualification and Performance Specification for Rigid Printed Boards |
| D | IPC-6012F(D)1 | - | 183€ | ||
| 6012D-FR | CD | IPC-6012D-FR(E)1 | 54 | 273€ | Spécification de la Qualification et des Performances des Circuits Imprimés Rigides |
| D | IPC-6012D-FR(D)1 | - | 283€ | ||
| 6012DS-FR | D | IPC-6012DS-FR(D)1 | - | 154€ | Avenant pour les Applications Spatiales et Aéronautiques Militaires de l'IPC-6012D |
| 6013E | LIV | IPC-6013E | 165 | 202€ | Qualification and Performance Specification for Flexible / Rigid-Flexible Printed Boards |
| D | IPC-6013E(D)1 | - | 183€ | ||
| 6015 | CD | IPC-6015(E)1 | 54 | 101€ | Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures |
| D | IPC-6015(D)1 | - | 111€ | ||
| 6017A | LIV | IPC-6017A | 100 | 118€ | Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry |
| D | IPC-6017A(D)1 | - | 111€ | ||
| 6018D | LIV | IPC-6018D | 180 | 202€ | Qualification and Performance Specification for High Frequency (Microwave) Printed Boards |
| D | IPC-6018D(D)1 | - | 183€ | ||
| 6901 | D | IPC/JPCA-6901(D)1 | - | 111€ | Application Categories for Printed Electronics |
| 6903A | D | IPC-6903A(D)1 | - | 113€ | Terms and Definitions for the Design and Manufacture of Printed Electronics |
| 7091A | LIV | IPC-7091A | 400 | 202€ | Design and Assembly Process Implementation of 3D Components |
| D | IPC-7091A(D)1 | - | 183€ | ||
| 7092A | LIV | IPC-7092A | 490 | 202€ | Design and Assembly Process Implementation for Embedded Components |
| D | IPC-7092A(D)1 | - | 183€ | ||
| 7093A | LIV | IPC-7093A | 500 | 202€ | Design and Assembly Process Implementation for Bottom Termination Components (BTCs) |
| D | IPC-7093A(D)1 | - | 183€ | ||
| 7094A | D | IPC-7094A(D)1 | - | 183€ | Design and Assembly Process Implementation for Flip Chip and Die Size Components |
| 7095E | LIV | IPC-7095E | 770 | 202€ | Design and Assembly Process Implementation for BGAs, with Amendment 1 |
| D | IPC-7095E(D)1 | - | 183€ | ||
| 7351B | D | IPC-7351B(D)1 | - | 183€ | Generic Requirements for Surface Mount Design and Land Pattern Standard |
| 7525C | LIV | IPC-7525C | 130 | 118€ | Stencil Design Guidelines |
| D | IPC-7525C(D)1 | - | 111€ | ||
| 7527 | D | IPC-7527(D)1 | - | 183€ | Requirements for Solder Paste Printing |
| 7530B | LIV | IPC-7530B | 150 | 202€ | Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) |
| D | IPC-7530A(D)1 | - | 183€ | ||
| 7711/21D | LIV | IPC-7711/21D | 1350 | 427€ | Rework, Modification and Repair of Electronic Assemblies |
| D | IPC-7711/21D(D)1 | - | 358€ | ||
| 7711/21C-FR | D | IPC-7711/21C-FR(D)1 | - | 514€ | Reprise, Modification et Réparation des Assemblages Electroniques |
| 7711/21C-AM1-FR | LIV | IPC-7711/21C-AM1-FR | 50 | 68€ | Amendement - Reprise, Modification et Réparation des Assemblages Electroniques |
| D | IPC-7711/21C-AM1-FR(D)1 | - | 62€ | ||
| 8497-1 | D | IPC-8497-1(D)1 | - | 183€ | Cleaning Methods and Contamination Assessment for Optical Assembly |
| 8921 | D | IPC-8921(D)1 | - | 173€ | Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and / or Wires |
| 9111 | D | IPC-9111(D)1 | - | 213€ | Troubleshooting for Printed Board Assembly Processes |
| 9121A | LIV | IPC-9121A | 950 | 437€ | Troubleshooting for PCB Fabrication Processes |
| D | IPC-9121A(D)1 | - | 371€ | ||
| 9191 | CD | IPC-9191(E)1 | 54 | 138€ | General Guidelines for Implementation of Statistical Process Control (SPC) |
| D | IPC-9191(D)1 | - | 148€ | ||
| 9201A | D | IPC-9201A(D)1 | - | 183€ | Surface Insulation Resistance Handbook |
| 9202A | LIV | IPC-9202A | 40 | 118€ | Material and Process Characterization / Qualification Test Protocol for Assessing Electrochemical Performance |
| D | IPC-9202A(D)1 | - | 111€ | ||
| 9203A | LIV | IPC-9203A | 200 | 202€ | Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle |
| D | IPC-9203A(D)1 | - | 183€ | ||
| 9204 | CD | IPC-9204(E)1 | 54 | 94€ | Guideline on Flexibility and Stretchability Testing for Printed Electronics |
| D | IPC-9204(D)1 | - | 104€ | ||
| 9241 | D | IPC-9241(D)1 | - | 183€ | Guidelines for Microsection Preparation |
| 9252B | D | IPC-9252B(D)1 | - | 111€ | Requirements for Electrical Testing of Unpopulated Printed Boards |
| 9257 | LIV | IPC-9257 | 105 | 163€ | Requirements for Electrical Testing of Flexible Printed Electronics |
| D | IPC-9257(D)1 | - | 151€ | ||
| 9301 | D | IPC-9301(D)1 | - | 175€ | IPC/JEDEC Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability |
| 9505 | D | IPC-9505(D)1 | - | 113€ | Guideline Methodology for Assessing Component and Cleaning Materials Compatibility |
| 9641 | CD | IPC-9641(E)1 | 54 | 101€ | High Temperature Printed Board Flatness Guideline |
| D | IPC-9641(D)1 | - | 111€ | ||
| 9691B | D | IPC-9691B(D)1 | - | 183€ | User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) |
| 9701B | LIV | IPC-9701B | 75 | 118€ | Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments |
| D | IPC-9701B(E)1 | - | 108€ | ||
| 9704A | CD | IPC-9704A(E)1 | 54 | 173€ | Printed Circuit Assembly Strain Gage Test Guideline |
| D | IPC-9704A(E)1 | - | 183€ | ||
| 9708 | D | IPC-9708(D)1 | - | 183€ | Test Methods for Characterization of Printed Board Assembly Pad Cratering |
| 9709A | LIV | IPC-9709A | 59 | 202€ | Guidelines for Acoustic Emission Measurement Method during Mechanical Testing |
| D | IPC-9709A(D)1 | - | 183€ | ||
| 9797A | LIV | IPC-9797A | 180 | 190€ | Press-fit Standard for Automotive Requirements and other High-Reliability Applications |
| D | IPC-9797A(D)1 | - | 173€ | ||
| HERMES-9852 V1.6 | LIV | IPC-HERMES-9852 V1.6 | 200 | 189€ | The Global Standard for Machine-to-Machine Communication in SMT Assembly |
| D | IPC-HERMES-9852(D)1 V1.6 | - | 167€ | ||
| A-600M | LIV | IPC-A-600M | 700 | 325€ | Acceptability of Printed Boards |
| D | IPC-A-600M(D)1 | - | 272€ | ||
| A-600K | LIV | IPC-A-600K | 760 | 325€ | Acceptability of Printed Boards |
| D | IPC-A-600K(D)1 | - | 272€ | ||
| A-600K-FR | LIV | IPC-A-600K-FR | 760 | 468€ | Acceptabilité des Circuits Imprimés (French language) |
| D | IPC-A-600K-FR(D)1 | - | 391€ | ||
| A-610J | LIV | IPC-A-610J | 1500 | 325€ | Acceptability of Electronic Assemblies |
| D | IPC-A-610J(D)1 | - | 272€ | ||
| A-610H-FR | LIV | IPC-A-610H-FR | 1500 | 468€ | Acceptabilité des assemblages électroniques (French Language) |
| D | IPC-A-610H-FR(D)1 | - | 391€ | ||
| A-620E | LIV | IPC/WHMA-A-620E | 1400 | 325€ | Requirements and Acceptance for Cable and Wire Harness Assemblies |
| D | IPC/WHMA-A-620E(D)1 | - | 272€ | ||
| A-620E-FR | LIV | IPC/WHMA-A-620E-FR | 1480 | 468€ | Exigences et Acceptation des Assemblages de Câbles et de Faisceaux de Fils (French Language) |
| D | IPC/WHMA-A-620E-FR(D)1 | - | 391€ | ||
| A-630 | D | IPC-A-630(D)1 | - | 183€ | Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures |
| IPC-A-640A | LIV | IPC-A-640A | 700 | 202€ | Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies |
| D | IPC-A-640A(D)1 | - | 183€ | ||
| AJ-820A | LIV | IPC-AJ-820A | 1028 | 202€ | Assembly & Joining Handbook |
| D | IPC-AJ-820A(D)1 | - | 183€ | ||
| CC-830C | D | IPC-CC-830C(D)1 | - | 111€ | Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies |
| CH-65B | D | IPC-CH-65B(D)1 | - | 183€ | Guidelines for Cleaning of Printed Boards and Assemblies |
| D-620A | D | IPC-D-620A(D)1 | - | 183€ | Design and Critical Process Requirements for Cable and Wiring Harnesses (kit products : WP-113A, WP114A, WP-116A) |
| D-640A | LIV | IPC-D-640A | 200 | 202€ | Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness assemblies |
| D | IPC-D-640A(D)1 | - | 183€ | ||
| IPC-DR-DES-2022 | LIV | IPC-DR-DES-2022 | 100 | 124€ | PCB Design Desk Reference 2022 Edition |
| IPC-DR-DES-2022-FR | LIV | IPC-DR-DES-2022-FR | 100 | 124€ | PCB Design Desk Reference 2022 Edition |
| IPC-QRG-18J | LIV | IPC-QRG-18J | 183 | 76€ | Component Identification Training and Reference Guide |
| D | IPC-QRG-18J(D)1 | - | 75€ | ||
| QRG-PTH-H | LIV | IPC-QRG-PTH-J | 100 | 76€ | Through-Hole SolderJoint Evaluation Training & Reference Guide |
| D | IPC-QRG-PTH-J(D)1 | - | 75€ | ||
| IPC-SMT-H | LIV | IPC-QRG-SMT-J | 115 | 76€ | Surface Mount Solder Joint Evaluation Training & Reference Guide |
| D | IPC-QRG-SMT-J(D)1 | - | 75€ | ||
| QRG-WHA-D | LIV | IPC-QRG-WHA-D | 160 | 76€ | Wire Harness Assembly Training & Reference Guide |
| D | IPC-QRG-WHA-D(D)1 | - | 75€ | ||
| HDBK-001H | LIV | IPC-HDBK-001H | 600 | 254€ | Handbook and Guide to Supplement IPC-J-STD-001 |
| D | IPC-HDBK-001H(D)1 | - | 228€ | ||
| HDBK-005 | D | IPC-HDBK-005(D)1 | - | 183€ | Guide to Solder Paste Assessment |
| HDBK-620 | D | IPC-HDBK-620(D)1 | - | 213€ | Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620 |
| HDBK-630 | D | IPC-HDBK-630(D)1 | - | 183€ | Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures |
| HDBK-830A | D | IPC-HDBK-830A(D)1 | - | 183€ | Guidelines for Design, Selection and Application of Conformal Coatings |
| HDBK-840 | CD | IPC-HDBK-840(E)1 | 54 | 173€ | Solder Mask Handbook |
| D | IPC-HDBK-840(D)1 | - | 183€ | ||
| HDBK-850 | D | IPC-HDBK-850(D)1 | - | 183€ | Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly |
| HDBK-9798 | LIV | IPC-HDBK-9798 | 400 | 165€ | Handbook for Press-Fit Standard for Automotive Requirements and other High-Reliability Applications |
| D | IPC-HDBK-9798(D)1 | - | 153€ | ||
| JP002 | CD | IPC-JP002(E)1 | 54 | 101€ | JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline |
| D | IPC-JP002(D)1 | - | 111€ | ||
| J-STD-001J | LIV | IPC-J-STD-001J | 300 | 260€ | Requirements for Soldered Electrical and Electronic Assemblies |
| D | IPC-J-STD-001J(D)1 | - | 205€ | ||
| J-STD-001HFR | LIV | IPC-J-STD-001H-FR | 300 | 363€ | Exigences Relatives aux Assemblages Electroniques et Electriques Brasés (French Language) |
| D | IPC-J-STD-001H-FR(D)1 | - | 304€ | ||
| J-STD-002E | D | IPC-J-STD-002E(D)1 | - | 153€ | EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires |
| J-STD-003D | LIV | IPC-J-STD-003D | 250 | 202€ | Solderability Tests for Printed Boards |
| D | IPC-J-STD-003D(D)1 | - | 183€ | ||
| J-STD-004D | LIV | IPC-J-STD-004D | 160 | 202€ | Requirements for Soldering Fluxes |
| D | IPC-J-STD-004D(D)1 | - | 183€ | ||
| J-STD-005B | LIV | IPC-J-STD-005B | 100 | 118€ | Requirements for Solder Pastes |
| D | IPC-J-STD-005B(D)1 | - | 111€ | ||
| J-STD-006C | D | IPC-J-STD-006C(D)1 | - | 111€ | Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications |
| J-STD-020F | LIV | IPC-J-STD-020F | 120 | 118€ | IPC/JEDEC Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices |
| D | IPC-J-STD-020F(D)1 | - | 111€ | ||
| J-STD-030A | CD | IPC-J-STD-030A(E)1 | 54 | 173€ | Selection and Application of Board Level Underfill Materials |
| D | IPC-J-STD-030A(D)1 | - | 183€ | ||
| J-STD-033D | D | IPC-J-STD-033D | - | 111€ | Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices |
| J-STD-075A | LIV | IPC-J-STD-075A | 160 | 119€ | Classification of Passive and Solid State Devices for Assembly Processes |
| D | IPC-J-STD-075A(D)1 | - | 113€ | ||
| J-STD-609C | LIV | IPC-J-STD-609C | 75 | 118€ | Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (PbFree) and Other Attributes |
| D | IPC-J-STD-609C(D)1 | - | 111€ | ||
| PE-740A | CD | IPC-PE-740A(E)1 | 54 | 173€ | Troubleshooting for Printed Board Manufacture and Assembly |
| D | IPC-PE-740A(D)1 | - | 183€ | ||
| QE-605A | D | IPC-QE-605A(D)1 | - | 183€ | Printed Board Quality Evaluation |
| SM-784 | D | IPC-SM-784(D)1 | - | 148€ | Guidelines for Chip-on-Board Technology Implementation |
| SM-785 | CD | IPC-SM-785(E)1 | 54 | 138€ | Guidelines for Accelerated Reliability Testing of Surface Mount Attachments |
| D | IPC-SM-785(D)1 | - | 148€ | ||
| SM-817A | D | IPC-SM-817A(D)1 | - | 111€ | General Requirements for Dielectric Surface Mount Adhesives |
| SM-840E | D | IPC-SM-840E(D)1 | - | 111€ | Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials |
| T-50N | LIV | IPC-T-50N | 330 | 202€ | Terms and Definitions for Interconnecting and Packaging Electronic Circuits |
| D | IPC-T-50N(D)1 | - | 183€ | ||
| T-50M-FR | D | IPC-T-50M-FR(D)1 | - | 260€ | Termes et Définitions pour les Circuits Electroniques Imprimés et Assemblés (French Language) |
| IPC-T-51 | LIV | IPC-T-51 | 80 | 118€ | Terms and Definitions for Design and Manufacture of Printed Electronics |
| D | IPC-T-51(D)1 | - | 111€ | ||
| WP-019B | LIV | IPC-WP-019B | 103 | 113€ | An Overview on the Global Change in Ionic Cleanliness Requirements |
| D | IPC-WP-019B(D)1 | - | 108€ | ||
| WP-019A-FR | D | IPC-WP-019A-FR(D)1 | - | 149€ | Présentation des Modifications Générales des Exigences en Matière de Propreté ionique |